- laser-scribing machine
- лазерная разметочная машина, лазерная координатно-разметочная машина
English-Russian dictionary of mechanical engineering and automation. - RUSSO. B.S. Voskoboinikov, V.L. Mitrovich. 2003.
English-Russian dictionary of mechanical engineering and automation. - RUSSO. B.S. Voskoboinikov, V.L. Mitrovich. 2003.
Laser cutting — process on a sheet of steel. CAD (top) and stainless steel laser cut part (bottom) Laser cutting is a technology that uses a laser to cut materials, an … Wikipedia
Beam compass — A beam compass is a compass with a beam and sliding sockets or cursors for drawing and dividing circles larger than those made by a regular pair of compasses.[1] The instrument can be as a whole, or made on the spot with individual sockets… … Wikipedia
Marking gauge — Stanley and Veritas marking gauges A marking gauge, also known as a scratch gauge,[1] is used in woodworking and metalworking to mark out lines for cutting or other operations.[2] … Wikipedia
radiation — radiational, adj. /ray dee ay sheuhn/, n. 1. Physics. a. the process in which energy is emitted as particles or waves. b. the complete process in which energy is emitted by one body, transmitted through an intervening medium or space, and… … Universalium
Tool — For other uses, see Tool (disambiguation). A modern toolbox. A tool is a device that can be used to produce an item or achieve a task, but that is not consumed in the process. Informally the word is also used to describe a procedure or process… … Wikipedia
Compass (drafting) — This article is about the drafting instrument. For other uses, see Compass (disambiguation). A beam compass and a regular compass … Wikipedia
industrial glass — Introduction solid material that is normally lustrous and transparent in appearance and that shows great durability under exposure to the natural elements. These three properties lustre, transparency, and durability make glass a favoured… … Universalium
Marking out — For other uses, see Marking out (disambiguation). Marking out or layout is the process of transferring a design or pattern to a workpiece, as the first step in the manufacturing process. It is performed in many industries or hobbies although in… … Wikipedia
Wafer dicing — is the process by which individual silicon chips or integrated circuits on a silicon wafer are separated following the processing of the wafer. The dicing process can be accomplished by scribing and breaking, by mechanical sawing (normally with a … Wikipedia